180 www.littelfuse.com multiline transient voltage surge suppressor mln surgearray ? suppressor the mln surgearray ? suppressor is designed to help protect compo- nents from transient voltages that exist at the circuit board level. this device provides four independent suppressors in a single leadless chip in order to reduce part count and placement time as well as save space on printed circuit boards. surgearray ? devices are intended to suppress esd, eft and other transients in order to protect integrated circuits or other sensitive components operating at any voltage up to 18v dc . surgearray devices are rated to the iec 61000-4-2 human body model esd to help products attain emc compliance. the array offers excellent isolation and low crosstalk between sections. the inherent capacitance of the surgearray suppressor permits it to function as a filter/suppressor , thereby replacing separate zener/ capacitor combinations. the mln array is manufactured using the littelfuse multilayer technology process and is similar to the littelfuse ml and mle ser ies of discrete leadless chips . the mln can also be pro vided in a dual v ersion. contact littelfuse for information. features ?rohs compliant ?four individual devices in one chip ?esd rated to iec 61000---- (le v el 4) ?a c char acter iz ed for impedance and capacitance ? low adjacent channel crosstalk, -55db at 10mhz (typ) ?lo w leakage ?oper ating voltage up to 18v m(dc) ?--5 o c to 125 o c operating temperature range ?low-profile, pcmcia compatible applications ?data, diagnostic i/o ports ?analog signal/sensor lines ?portable/hand-held products ?mobile comm unications/cellular phones ?computer/dsp products ?industrial instruments including medical rohs siz e metric eia 2012 0805 3216 1206
181 www .littelfuse .com 3 surf a ce mount v arist ors multiline transient voltage surge suppressor mln surgearray ? suppressor absolute maximum ratings for ratings of individual members of a series, see device ratings and specifications table. continuous: steady state applied voltage: dc voltage range (v m(dc) ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 v operating ambient temperature range (t a ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 125 o c storage temperature range (t stg ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 150 o c device ratings and specifications any single section temperature derating for applications exceeding 125 o c ambient temperature, the peak surge current and energy ratings must be reduced as shown in figure 1. pa r t number max ra tings (125 o c) performance specifications (25 o c) maximum continuous wor king vol tag e maximum non- repetitive surge current (8/20 s) s) typical esd suppression vol tag e (note 1) nominal vol tag e at 1ma dc current capa citance at 1mhz (1v p-p) v m(dc) i tm w (v) (a) (v) (v) (pf) v5.5mln40805 v5.5mln41206v9mln41206 v14mln41206 v18mln40805v18mln41206 v18mln41206l 220 520 250 300 140 175 75 125 notes: 1. te s ted to iec61000-4-2 human body model (hbm) discharge te st circuit. 2. direct discharge to de vice terminals (iec pr eff ered test method). 3. corona discharge through air (represents actual esd e ven t) 4. capacitance ma y be customized, contact sales . pea k (note 2) 8kv conta ct (note 3) 15kv air clamp (v) pea k (v) (v) v n(dc) min v n(dc) max (note 4) c typ max (pf) 75 5.5 5.5 9 1418 18 18 20 30 30 3020 3030 7.1 7.1 11.015.9 22.022.0 25.0 10.8 10.8 16.020.3 28.028.0 35.0 140 60 95 110260 165200 40 35 50 55 100 6395 90 45 7585 170100 130 maximum non- repetitive surge energy (10/1000 tm (j) 0.05 0.1 0.1 0.1 0.05 0.1 0.05 100 45 430 300 100 new new c maximum clamping vol tag e (at noted current 8/20 s) v (v) 19 at 1a 15.5 at 2a 23 at 2a 30 at 2a 50 at 1a 40 at 2a50 at 1a 100
90
80
70
60
50
40
30
20
10
0 -55
50
60
70
80
90
100
110
120
130
140
150
p e r c e n t o f r a t e d v a l u e ambient
tempera ture ( o c)
figure
1.
peak
current
and
energy
dera
ting
cur ve t t 1 t 2 100
90
50
10
o 1 time
p e r c e n t o f p e a k v a l u e rohs o 1 = vir
tu al origin of w a ve t 1 = vir
tu al fr ont time = 1.25 x t (impulse dura
tion) t = time fr
om 10%
t o 90% of peak t 2 = vir
tu al time t o half v alue example:
for an 8/20
s current w a veform:
8 s = t 1 = vir
tu al fr ont 20
s = t 2 = vir
tu al
time t o half
v alue time
f figure
2.
peak
pulse current
test
w a veform
for clamping
v o l t a ge
surface mount varistors 182 www.littelfuse.com multiline transient voltage surge suppressor typical performance curves an y single section mln surgearray ? suppressor rohs 0 5 10 15 20 25 0 10 100 1000 10 0 00 nu m be r of di sc ha rg es no m in a l vol t ag e v no m (v) v18 v14 v9 v5.5 figure 3. nominal voltage stability to iec 1000-4-2 (8kv contact method, one section) 1 10 10 0 0. 00 001 0.0001 0. 0 0 1 0. 0 1 0.1 1 10 10 0 cu r ren t (a) va r i st o r v ol ta g e (v ) figure 4. v-i chara cteristic, 0805 size v5 . 5 v1 8 max imum clamp voltag e max imum st and by 1 10 10 0 0. 00 001 0. 00 01 0. 00 1 0 .0 1 0. 1 1 10 10 0 cu rre nt (a ) va r is t or v ol t ag e (v ) fi gur e 5 . v- i characterist ic, 1 20 6 siz e max i mu m cla m p v ol ta ge max i mu m st an dby v5 .5 v9 v1 4 v1 8 v1 8 l v5 . 5 v9 v1 4 v1 8 v1 8 l 0. 1 1 10 100 0 0 0 0 1 0 0 0 1 0 0 1 0 1 sq u are wa ve im pu ls e d ur at i on (s) ss ur ge c ur rent (a ) 2 number of surges 1 10 10 0 10 10 4 10 5 10 6 3 fig ure 6. 08 05 s i ze pulse rating for l o ng dur a tio n su r ge s (an y singl e se ctio n) 0. 1 1 10 10 0 10 0 0 0 10 0 0 10 0 10 sq u ar e wa ve im pul s e du ra t ion ( s ) su rg e c ur r e nt (a ) 1 2 10 100 10 3 10 4 10 5 10 6 numb er of sur ge s figure 7. 1 206 size pulse rating for long duration surges (any single section) 0 10 0 20 0 30 0 40 0 50 0 1000 1 00 1 0 1 0. 1 frequenc y (m h z) ca p ac i ta n ce (p f ) v5.5 v9 v14 v18 v18l fi gu re 8. c a pac ita nce vs fr e que nc y
183 www .littelfuse .com 3 surf a ce mount v arist ors multiline transient voltage surge suppressor mln surgearray ? suppressor typical performance curves an y single section (continued) figure 1 1. cap aci tan ce vs frequency , 1206 size 1000 1mhz frequency ohms 100 10 1 0.1 10mhz 100mhz 1ghz 10ghz rohs -1 20 -1 00 -8 0 -6 0 -4 0 -2 0 0 1000 100 10 1 0.1 0.01 0.001 fr e que ncy ( mhz) cr os st al k ( d b ) figure 13. adj ace nt channel crosst alk v5 .5 v9 v1 4 v1 8 v1 8 l v in = 1v rms z = 50 0.1 1 10 10 0 10 0 0 10 0 0 0 0.1 1 10 100 1000 fr e que ncy ( mhz) im p ea n ce |z | ( ) figure 1 2. imped ance vs frequency , 1206 size v5. 5 v9 v14 v18 v18 l pa r all el capa cita nce , cp ( f ) figure 9. cap aci tan ce vs. frequency , 0805 size 000e +0 50e -12 100e -12 150e -12 200e -12 250e -12 300e -12 350e -12 400e -12 1.0e +06 1.0e +07 1. 0e +08 1. 0e +09 fr e qu e ncy ( h z) 5. 5v 18 v pa r al l el ca pa cit an ce , cp (f ) figure 1 0. impedence vs frequency , 0805 size fre quen c y ( hz ) 0. 1 1 10 10 0 10 0 0 10 0 0 0 1. 0 e+ 06 1. 0 e+ 07 1. 0 e+ 0 8 1. 0e +0 9 1. 0e +1 0 18v 5.5v
184 www.littelfuse.com multiline transient voltage surge suppressor mln surgearray ? suppressor rohs soldering recommendations lead (pb) soldering recommendations the principal techniques used for the soldering of components in surface mount technology are ir re-flow & wave soldering. typical profiles are shown in figures 14 & 15 the recommended solder for the mln surgearray suppressor is a 62/36/2 (sn/pb/ag), 60/40 (sn/pb) or 63/37 (sn/pb). littelfuse also rec- ommends an rma solder flux. wave soldering is the most strenuous of the processes. to avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. when using a reflow process, care should be taken to ensure that the mln chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal g r adient being 2 deg rees per second. dur ing the soldering process, preheating to within 100 degrees of the solders peak temperature is essential to minimize thermal shock. once the soldering process has been completed, it is still necessary to ensure that an y fur ther ther mal shocks are avoided. one possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solv ents at room temper ature . the boards must be allowed to cool gradually to less than 50?c before cleaning. lead-free (pb-free) soldering recommendations littelfuse offers the 0805 array as the preferred solution for lead-free sol- dering conditions. the preferred solder is 96.5/3.0/0.5 (snagcu) with an rma flux, but there is a wide selection of pastes & fluxes available with which the nick- el barrier parts should be compatible. the reflow profile must be constrained by maximums shown in figure16. f or pb-free wave soldering, figure 15 still applies. note: the pb-free paste, flux & profile were used for evaluation purposes b y littelfuse , based upon industr y standards & pr actices . there are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. figure 14. reflow solder profile figure 15. wave solder profile figure 16. lead-free re-flow so lder profile tempera ture ( o c) time (minutes) 300 250 200 150 100 50 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 maximum wave 260 o c second preheat first preheat 5. 0 6 .0 7. 0 maxi m um t emperat ur e 26 0? c 20 - 40 s e cond s wi t hin 5? preh ea t zone ra mp rat e <3 ? c/ s 60 - 150 sec > 2 17 ? c 23 0 figure 14. reflow solder profile figure 15. wave solder profile figure 16. lead-free re-flow so lder profile tempera ture ( o c) time (minutes) 300 250 200 150 100 50 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 maximum wave 260 o c second preheat first preheat 5. 0 6 .0 7. 0 maxi m um t emperat ur e 26 0? c 20 - 40 s e cond s wi t hin 5? preh ea t zone ra mp rat e <3 ? c/ s 60 - 150 sec > 2 17 ? c 23 0
185 www .littelfuse .com 3 surf a ce mount v arist ors multiline transient voltage surge suppressor recommended p ad outline e
d
a
b
c
abcd e millimeters 0.90 1.30 2.20 0.35 0.50 inches 0.035 0.051 0.087 0.014 0.02 0805 1206 size units millimeters 0.89 1.65 2.54 0.46 0.79 inches 0.035 0.065 0.100 0.018 0.030 p
l
t
s
x
bl
b w
w
l w t bw bl p x s inch 0.080 0.008 0.050 0.008 0.038 max 0.012 0.004 0.007 +0.01/- 0.002 0.020 ref 0.030 0.004 0.010 0.004 millimeter 2.03 0.2 1.27 0.2 1.10 max 0.30 0.1 0.18 +0.25/-0.05 0.508 ref 0.76 0.1 0.254 0.1 0.126 0.008 0.063 0.008 0.053 max 0.016 0.004 0.007 +0.01/- 0.002 0.030 ref 0.045 0.004 0.015 0.004 3.2 0.2 1.6 0.2 1.35 max 0.41 0.1 0.18 +0.25/-0.05 0.76 ref 1.14 0.1 0.38 0.1 inch millimeter 0805 1206 size units mechanical dimensions table 1. pad layout dimensions mln surgearray ? suppressor rohs
186 www.littelfuse.com multiline transient voltage surge suppressor ordering information vxxmln types v 18 1206 pac king options a: 2500 piece bulk p ack h: 7in (178mm) diameter reel (note) t : 13in (330mm) diameter reel (note) note: see standard shipping quantities table. device size: 0805: 80mil x 50mil 1206: 120mil x 60mil device fam ily tvss device maximum dc wor king vol tag e ml n series designat or n: array w t end termination option w: ag/p d /p t multil ay e r designat or 4 number of sections (1206 only) n: nic kel barrier (0805 only) tape and reel specifications ?conforms to eia - 481, revision a ?can be supplied to iec publication 286 - 3 symbol
description
millimeters
a
0
width
of
cavity
dependent
on
chip
size
to
minimize
rotation.
b
0
length
of
cavity
dependent
on
chip
size
to
minimize
rotation.
k
0
depth
of
cavity
dependent
on
chip
size
to
minimize
rotation.
w
w
idth
of
tape
8
0.2
f
d
istance
between
drive
hole
centers
and
cavity
centers
3
.5
0.5
e
d
istance
between
drive
hole
centers
and
tape
edge
1.75
0.1
p
1
distance
between
cavity
center
4
0.1
p
2
axial
distance
between
drive
hole
centers
and
cavity
centers
2
0.1
p
0
axial
distance
between
drive
hole
centers
4
0.1
d
0
drive
hole
diameter
1.55
0.05
d
1
diameter
of
cavity
piercing
1.05
0.05
t
1
embossed
tape
thickness
0.3
max
t
2
top
tape
thickness
0.1
max
no
te:
dimensions
in
millimeters
.
standard shipping quantities k
0
t
1
t
2
d
0
p
0
d
1
p
1
a
0
p
2
b
0
f
e
w
plastic carrier
t
ape
embossment
t
op
t
ape
8mm
nominal
pr
oduct
identifying
label
178mm
or 330mm
dia.
reel
device size 13 inch reel (t option) 7 inch reel (h option) bul k pac k (a option) 0805 and 1206 10,000 2,500 2,500 mln surgearray ? suppressor rohs
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